Circuiti integrati (CI)

Parte n. fabbricante Descrizione Serie Caso del pacchetto
MCZ33905CD5EKR2 NXP USA Inc. IC SBC CAN HS 5.0V 54SOIC - 54-SSOP (0.295", 7.50mm Width) Exposed Pad
ZSC31150GEG2-R IDT, Integrated Device Technology Inc SENSOR SIGNAL CONDITIONER *
ZSSC3220BI3R IDT, Integrated Device Technology Inc SENSOR SIGNAL CONDITIONER *
MCZ33903CS3EKR2 NXP USA Inc. IC SBC CAN HS 3.3V 32SOIC - 32-SSOP (0.295", 7.50mm Width) Exposed Pad
MC33889BPEGR2 NXP USA Inc. IC SYSTEM BASIS W/CAN 28SOIC - 28-SOIC (0.295", 7.50mm Width)
TJA1080ATS/2/T,112 NXP USA Inc. IC TXRX FLEXRAY 20-SSOP - 20-SSOP (0.209", 5.30mm Width)
MC33972ATEK NXP USA Inc. IC SWITCH DETECT SPI 32-SOIC - 32-SSOP (0.295", 7.50mm Width) Exposed Pad
PTN3460IBS/F1Z NXP USA Inc. IC BRIDGE DISP PORT-LVDS 56HVQFN - 56-VFQFN Exposed Pad
PTN3460IBS/F2Z NXP USA Inc. IC DISPLAYPORT TO LVDS 56HVQFN - 56-VFQFN Exposed Pad
ZSC31150GLG1-R IDT, Integrated Device Technology Inc SENSOR SIGNAL CONDITIONER *
ZSSC3170EA2T IDT, Integrated Device Technology Inc SENSOR SIGNAL CONDITIONER *
ZSSC3170EE2T IDT, Integrated Device Technology Inc SENSOR SIGNAL CONDITIONER *
ZSSC3170FE2T IDT, Integrated Device Technology Inc SENSOR SIGNAL CONDITIONER *
MCZ33905CS3EKR2 NXP USA Inc. IC SBC CAN HS 3.3V 32SOIC - 32-SSOP (0.295", 7.50mm Width) Exposed Pad
MCZ33905CS5EKR2 NXP USA Inc. IC SBC CAN HS 5.0V 32SOIC - 32-SSOP (0.295", 7.50mm Width) Exposed Pad
ZSC31015EIG1-T IDT, Integrated Device Technology Inc SENSOR SIGNAL CONDITIONER *
ZSC31150GEG1-T IDT, Integrated Device Technology Inc SENSOR SIGNAL CONDITIONER * 14-SSOP (0.209", 5.30mm Width)
ZSSC3154BA3R IDT, Integrated Device Technology Inc SENSOR SIGNAL CONDITIONER *
ZSSC3154BA3V IDT, Integrated Device Technology Inc SENSOR SIGNAL CONDITIONER *
ZSSC3154BE3R IDT, Integrated Device Technology Inc SENSOR SIGNAL CONDITIONER *
ZSSC3154BE3V IDT, Integrated Device Technology Inc SENSOR SIGNAL CONDITIONER *
ZSSC3123AA2T IDT, Integrated Device Technology Inc SENSOR SIGNAL CONDITIONER *
ZSC31050FIG1-T IDT, Integrated Device Technology Inc SENSOR SIGNAL CONDITIONER *
MCZ33903DP3EK NXP USA Inc. SYSTEM BASIS CHIP 2X 3.3 V/400M -
MCZ33903DP5EK NXP USA Inc. SYSTEM BASIS CHIP 2X 5.0 V/400M -
ZSC31050FEG1-R IDT, Integrated Device Technology Inc SENSOR SIGNAL CONDITIONER *
ZSC31015EAG1-T IDT, Integrated Device Technology Inc SENSOR SIGNAL CONDITIONER *
MCZ33904D3EK NXP USA Inc. SYSTEM BASIS CHIP 2X 3.3 V/400M -
MCZ33904D5EK NXP USA Inc. SYSTEM BASIS CHIP 2X 5.0 V/400M -
ZSSC3123AI2T IDT, Integrated Device Technology Inc SENSOR SIGNAL CONDITIONER *
MCZ33903D3EK NXP USA Inc. SYSTEM BASIS CHIP 2X 3.3 V/400M -
MCZ33903D5EK NXP USA Inc. SYSTEM BASIS CHIP 2X 5.0 V/400M -
MC33742PEG NXP USA Inc. IC SYSTEM BASE W/CAN 28SOIC - 28-SOIC (0.295", 7.50mm Width)
MCZ33903C3EK NXP USA Inc. IC SBC CAN HS 3.3V 32SOIC - 32-SSOP (0.295", 7.50mm Width) Exposed Pad
MCZ33903C5EK NXP USA Inc. IC SBC CAN HS 5.0V 32SOIC - 32-SSOP (0.295", 7.50mm Width) Exposed Pad
MCZ33903DS3EK NXP USA Inc. SYSTEM BASIS CHIP LIN 2X 3.3 V -
MCZ33903DS5EK NXP USA Inc. SYSTEM BASIS CHIPLIN 2X 5.0 V/ -
MCZ33780EGR2 NXP USA Inc. IC MASTER DUAL DBUS DIFF 16-SOIC - 16-SOIC (0.295", 7.50mm Width)
ZSSC3131BE2T IDT, Integrated Device Technology Inc SENSOR SIGNAL CONDITIONER *
ZSC31150GEG2-V IDT, Integrated Device Technology Inc SENSOR SIGNAL CONDITIONER *
MCZ33905DS3EK NXP USA Inc. SYSTEM BASIS CHIP LIN 2X 3.3 V -
MCZ33905DS5EK NXP USA Inc. SYSTEM BASIS CHIP LIN 2X 5.0 V -
ZSSC3136BA2T IDT, Integrated Device Technology Inc SENSOR SIGNAL CONDITIONER *
ZSC31015EEG1-T IDT, Integrated Device Technology Inc SENSOR SIGNAL CONDITIONER *
MCZ33903DD3EK NXP USA Inc. SYSTEM BASIS CHIP 2 LIN 2X 3.3 -
MCZ33903DD5EK NXP USA Inc. SYSTEM BASIS CHIP 2 LIN 2X 5.0 -
ZSSC3015NE2T IDT, Integrated Device Technology Inc SENSOR SIGNAL CONDITIONER *
MCZ33903CD3EK NXP USA Inc. IC SBC CAN HS 3.3V 32SOIC - 32-SSOP (0.295", 7.50mm Width) Exposed Pad
MCZ33903CD5EK NXP USA Inc. IC SBC CAN HS 5.0V 32SOIC - 32-SSOP (0.295", 7.50mm Width) Exposed Pad
MC33989PEG NXP USA Inc. IC SYSTEM BASE W/CAN 28SOIC - 28-SOIC (0.295", 7.50mm Width)