| DS21Q554B+ |
Maxim Integrated |
IC TXRX E1 QUAD 5V 256BGA |
- |
256-BGA |
| PM8312-PGI |
Microsemi Corporation |
32CHANNEL T1/E1 FRAMER DEVICE WI |
* |
|
| PM8312-PI |
Microsemi Corporation |
32CHANNEL T1/E1 FRAMER DEVICE WI |
* |
|
| MAX3941ETG+ |
Maxim Integrated |
IC EAM DRIVER 10GBPS 24-TQFN |
- |
24-WFQFN Exposed Pad |
| ZL50117GAG2 |
Microsemi Corporation |
IC CESOP PROCESSOR 128CH 324BGA |
- |
324-BGA |
| DS21Q354C1+ |
Maxim Integrated |
IC TXRX T1/E1 QUAD 256-BGA |
- |
256-BGA |
| DS21Q554BN+ |
Maxim Integrated |
IC TXRX E1 QUAD 256BGA |
- |
256-BGA |
| PM7382-PGI |
Microsemi Corporation |
32 LINK, 256 HDLC CHANNEL FRAME |
* |
|
| VSC7460YIH |
Microsemi Corporation |
JAGUAR-1, 24X1G+4X10G CARRIER ET |
Jaguar™-1 |
|
| VSC8492YJD-12 |
Microsemi Corporation |
DUAL/QUAD 10GBE PHY W/OTN-FEC |
* |
|
| VSC8494YJE-12 |
Microsemi Corporation |
DUAL/QUAD 10GE PHY W/OTN-FEC |
* |
|
| PM4332-PGI |
Microsemi Corporation |
32 CHANNEL T1/E1 FRAMER |
* |
|
| MT90869AG2 |
Microsemi Corporation |
IC DGTL SWITCH F16KDX 272BGA |
- |
272-BGA |
| PM7382-PI |
Microsemi Corporation |
TELECOM INTERFACE ICS 32 LINK |
* |
|
| VSC8492YJD-13 |
Microsemi Corporation |
DUAL/QUAD 10GBE UNIV PHY W/OTN-F |
* |
|
| ZL50110GAG2 |
Microsemi Corporation |
IC CESOP PROC 256CH 552BGA |
- |
552-BGA |
| VSC8496YMJ |
Microsemi Corporation |
4X10GE TRANSCEIVER WITH OTN-FEC |
* |
|
| VSC7464YIH-02 |
Microsemi Corporation |
12X1G + 24X1G OR 24X1G + 2X10G ( |
LynX™-2 |
|
| DS21Q354B+ |
Maxim Integrated |
IC TXRX QUAD E1 3.3V 256-BGA |
- |
256-BGA |
| PM5334A-FEI |
Microsemi Corporation |
SINGLE-CHIP SONET/SDH TRANSPORT |
* |
|
| XRT75R12IB-L |
MaxLinear, Inc. |
IC LIU E3/DS3/STS-1 12CH 420TBGA |
- |
420-LBGA |
| VSC7468YIH-02 |
Microsemi Corporation |
24X1G + 4X10G OR 48X1G + 2X10G ( |
Jaguar™-2 |
|
| PM8321-PGI |
Microsemi Corporation |
HIGH DENSITY FRAMER/MAPPER FOR 8 |
* |
|
| PM8324-FEI |
Microsemi Corporation |
TEMAP 84FDL GREEN DUAL PASSIVATI |
* |
|
| DS34S132GNA2+ |
Maxim Integrated |
IC TDM PACKET 32PORT 676PBGA |
- |
676-BGA |
| PM4390-FEI |
Microsemi Corporation |
ARROW M8XFE |
* |
|
| ZL50112GAG2 |
Microsemi Corporation |
IC CESOP PROCESSOR 552BGA |
- |
552-BGA |
| PM8321-PI |
Microsemi Corporation |
HIGH DENSITY FRAMER/MAPPER FOR 8 |
* |
|
| VSC8494YJE-13 |
Microsemi Corporation |
DUAL/QUAD 10GBE UNIV PHY W/OTN-F |
* |
|
| PM8324-FXI |
Microsemi Corporation |
TEMAP 84FDL, LF BUMP |
* |
|
| PM5329-FEI |
Microsemi Corporation |
ARROW 24XFE PB FREE |
* |
|
| PM8318-FXI |
Microsemi Corporation |
TEMAP 168, LF BUMP |
* |
|
| PM8320-PGI |
Microsemi Corporation |
TEMUX-84 WITH E3 MAPPERS, DS3/E3 |
- |
324-FBGA |
| PM8320-PI |
Microsemi Corporation |
TEMUX-84 WITH E3 MAPPERS, DS3/E3 |
- |
324-FBGA |
| ZL50111GAG2 |
Microsemi Corporation |
IC CESOP PROC 1024CH 552BGA |
- |
552-BGA |
| PM5397-FEI |
Microsemi Corporation |
ARROW 2XGE PB FREE |
* |
|
| PM5397-FGI |
Microsemi Corporation |
ARROW 2XGE PB FREE |
* |
|
| PM5397H-FXI |
Microsemi Corporation |
ARROW 2XGE |
* |
|
| PM8316-PGI |
Microsemi Corporation |
84/63 CHANNEL T1/E1 FRAMER DEVIC |
* |
|
| PM8316-PI |
Microsemi Corporation |
84/63 CHANNEL T1/E1 FRAMER DEVIC |
* |
|
| XRT83L30ES |
MaxLinear, Inc. |
IC LIU LH/SH T1/E1 SGL 64TQFP |
- |
|
| XRT83SL30ES |
MaxLinear, Inc. |
IC LIU LH/SH T1/E1 SGL 64TQFP |
- |
|
| PM5329-FXI |
Microsemi Corporation |
ARROW 24XFE |
* |
|
| PM5336B-FEI |
Microsemi Corporation |
ARROW 2488, PB FREE |
* |
|
| PM8311A-FEI |
Microsemi Corporation |
TEMUX 168 PB FREE |
* |
|
| PM5336B-FXI |
Microsemi Corporation |
ARROW 2488, PB FREE |
* |
|
| PM5308-FEI |
Microsemi Corporation |
TSE-120 (PB FREE) |
* |
|
| PM5324-FEI |
Microsemi Corporation |
PM5324: ARROW-1X192 |
- |
1292-BGA, FCBGA |
| PM5308-FXI |
Microsemi Corporation |
TSE-120 |
* |
|
| PM5377-FEI |
Microsemi Corporation |
TSE-240 (PB FREE) |
* |
|
