| ZSSC3015NA2R |
IDT, Integrated Device Technology Inc |
SENSOR SIGNAL CONDITIONER |
* |
|
| ZSSC4165BE2W |
IDT, Integrated Device Technology Inc |
SENSOR SIGNAL CONDITIONER |
* |
|
| ZSSC4175BE2W |
IDT, Integrated Device Technology Inc |
SENSOR SIGNAL CONDITIONER |
* |
|
| MCZ33904D3EKR2 |
NXP USA Inc. |
SYSTEM BASIS CHIP 2X 3.3 V/400M |
- |
|
| MCZ33904D5EKR2 |
NXP USA Inc. |
SYSTEM BASIS CHIP 2X 5.0 V/400M |
- |
|
| MCZ33903D3EKR2 |
NXP USA Inc. |
SYSTEM BASIS CHIP 2X 3.3 V/400M |
- |
|
| MCZ33903D5EKR2 |
NXP USA Inc. |
SYSTEM BASIS CHIP 2X 5.0 V/400M |
- |
|
| MCZ33904C3EKR2 |
NXP USA Inc. |
IC SBC CAN HS 3.3V 32SOIC |
- |
32-SSOP (0.295", 7.50mm Width) Exposed Pad |
| ZSSC3135BE2R |
IDT, Integrated Device Technology Inc |
SENSOR SIGNAL CONDITIONER |
* |
|
| ZSSC3136BA2R |
IDT, Integrated Device Technology Inc |
SENSOR SIGNAL CONDITIONER |
* |
|
| ZSSC3131BE2R |
IDT, Integrated Device Technology Inc |
SENSOR SIGNAL CONDITIONER |
* |
|
| MCZ33903DS3EKR2 |
NXP USA Inc. |
SYSTEM BASIS CHIP LIN 2X 3.3 V |
- |
|
| MCZ33903DS5EKR2 |
NXP USA Inc. |
SYSTEM BASIS CHIPLIN 2X 5.0 V/ |
- |
|
| ZSSC5101BE4R |
IDT, Integrated Device Technology Inc |
SENSOR SIGNAL CONDITIONER |
* |
|
| ZSSC3138BA2R |
IDT, Integrated Device Technology Inc |
SENSOR SIGNAL CONDITIONER |
* |
|
| ZSSC3131BA2T |
IDT, Integrated Device Technology Inc |
SENSOR SIGNAL CONDITIONER |
* |
|
| ZSSC3224BI3R |
IDT, Integrated Device Technology Inc |
SENSOR SIGNAL CONDITIONER |
* |
|
| ZSSC3136BE2R |
IDT, Integrated Device Technology Inc |
SENSOR SIGNAL CONDITIONER |
* |
|
| ZSSC3015NE2R |
IDT, Integrated Device Technology Inc |
SENSOR SIGNAL CONDITIONER |
* |
|
| ZSSC3138BE2R |
IDT, Integrated Device Technology Inc |
SENSOR SIGNAL CONDITIONER |
* |
|
| MCZ33905DS3EKR2 |
NXP USA Inc. |
SYSTEM BASIS CHIP LIN 2X 3.3 V |
- |
|
| MCZ33905DS5EKR2 |
NXP USA Inc. |
SYSTEM BASIS CHIP LIN 2X 5.0 V |
- |
|
| ZSSC3135BA2T |
IDT, Integrated Device Technology Inc |
SENSOR SIGNAL CONDITIONER |
* |
|
| ZSSC3015NA2T |
IDT, Integrated Device Technology Inc |
SENSOR SIGNAL CONDITIONER |
* |
|
| MCZ33903DD3EKR2 |
NXP USA Inc. |
SYSTEM BASIS CHIP 2 LIN 2X 3.3 |
- |
|
| MCZ33903DD5EKR2 |
NXP USA Inc. |
SYSTEM BASIS CHIP 2 LIN 2X 5.0 |
- |
|
| MCZ33903CD3EKR2 |
NXP USA Inc. |
IC SBC CAN HS 3.3V 32SOIC |
- |
32-SSOP (0.295", 7.50mm Width) Exposed Pad |
| MCZ33903CD5EKR2 |
NXP USA Inc. |
IC SBC CAN HS 5.0V 32SOIC |
- |
32-SSOP (0.295", 7.50mm Width) Exposed Pad |
| ZSC31150GAG2-R |
IDT, Integrated Device Technology Inc |
SENSOR SIGNAL CONDITIONER |
* |
|
| ZSC31150GAG2-V |
IDT, Integrated Device Technology Inc |
SENSOR SIGNAL CONDITIONER |
* |
|
| ZSSC3135BE2T |
IDT, Integrated Device Technology Inc |
SENSOR SIGNAL CONDITIONER |
* |
|
| TDA8026ET/C3E |
NXP USA Inc. |
MULTIPLE SMART CARD SLOT INTERFA |
- |
64-TFBGA |
| ZSSC3170EA2R |
IDT, Integrated Device Technology Inc |
SENSOR SIGNAL CONDITIONER |
* |
|
| ZSSC3170EA3R |
IDT, Integrated Device Technology Inc |
SENSOR SIGNAL CONDITIONER |
* |
|
| ZSSC3170EE2R |
IDT, Integrated Device Technology Inc |
SENSOR SIGNAL CONDITIONER |
* |
|
| ZSSC3170EE3R |
IDT, Integrated Device Technology Inc |
SENSOR SIGNAL CONDITIONER |
* |
|
| ZSSC3170FA2R |
IDT, Integrated Device Technology Inc |
SENSOR SIGNAL CONDITIONER |
* |
|
| ZSSC3170FE2R |
IDT, Integrated Device Technology Inc |
SENSOR SIGNAL CONDITIONER |
* |
|
| ZSC31010CEG1-T |
IDT, Integrated Device Technology Inc |
SENSOR SIGNAL CONDITIONER |
* |
|
| MC33689DPEW |
NXP USA Inc. |
IC SYSTEM BASIS W/LIN 32SOIC |
- |
32-BSSOP (0.295", 7.50mm Width) |
| ZSSC5101BE4T |
IDT, Integrated Device Technology Inc |
SENSOR SIGNAL CONDITIONER |
* |
|
| ZSSC3138BA2T |
IDT, Integrated Device Technology Inc |
SENSOR SIGNAL CONDITIONER |
* |
|
| ZSSC3136BE2T |
IDT, Integrated Device Technology Inc |
SENSOR SIGNAL CONDITIONER |
* |
|
| MC33989PEGR2 |
NXP USA Inc. |
IC SYSTEM BASE W/CAN 28SOIC |
- |
28-SOIC (0.295", 7.50mm Width) |
| ZSSC3138BE2T |
IDT, Integrated Device Technology Inc |
SENSOR SIGNAL CONDITIONER |
* |
|
| MCZ33903CP3EKR2 |
NXP USA Inc. |
IC SBC CAN HS 3.3V 32SOIC |
- |
32-SSOP (0.295", 7.50mm Width) Exposed Pad |
| MCZ33903CP5EKR2 |
NXP USA Inc. |
IC SBC CAN HS 5.0V 32SOIC |
- |
32-SSOP (0.295", 7.50mm Width) Exposed Pad |
| MCZ33905DD3EKR2 |
NXP USA Inc. |
SYSTEM BASIS CHIP 2 LIN 2X 3.3 |
- |
|
| MCZ33905DD5EKR2 |
NXP USA Inc. |
SYSTEM BASIS CHIP 2 LIN 2X 5.0 |
- |
|
| MCZ33905CD3EKR2 |
NXP USA Inc. |
IC SBC CAN HS 3.3V 54SOIC |
- |
54-SSOP (0.295", 7.50mm Width) Exposed Pad |
